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Non-woven pad - List of Manufacturers, Suppliers, Companies and Products

Non-woven pad Product List

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【Polishing Pad (PAD)】Achieve high-quality precision polishing! Non-woven fabric pad.

【Polishing Pad (PAD)】Achieve high-quality precision polishing! Non-woven fabric pad.

Non-woven fabric pads in the first grinding process! An introduction to non-woven fabric pads in a column.

The polishing pads used in the first grinding process are mainly polyurethane pads, commonly known as urethane pads. However, there are cases where non-woven fabric polishing pads (hereinafter referred to as non-woven pads) are used separately. Non-woven pads refer to polishing cloths made by binding short fibers, known as non-woven fabric, with resin, and they are generally available in white. Since non-woven pads are not made solely of resin, they tend to have a lower grinding rate compared to urethane pads, but they have advantages in terms of surface accuracy and ease of handling. *For more details on the column, please refer to the related links. If you have any questions, feel free to contact us.*

  • Other abrasives

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Non-woven fabric pad "Suba(TM)"

Non-woven fabric pad "Suba(TM)"

A non-woven fabric-based polishing pad that responds well to various applications.

"Suba(TM)" is a polishing pad made from polyester fibers, with polyurethane impregnated into a non-woven fabric formed by a dry process. It demonstrates excellent performance primarily for primary and secondary polishing of silicon wafers, sapphire wafers, and oxide wafers. It can also be used for edge polishing and notch polishing, and offers a wide range of products tailored to each process. 【Features】 ■ High polishing rate ■ Low defect rate ■ High flatness *For more details, please refer to the catalog or feel free to contact us.

  • Other abrasives
  • Wafer processing/polishing equipment
  • Hand polishing and filing

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Non-woven fabric pad "SUBA(TM)"

Non-woven fabric pad "SUBA(TM)"

Versatile and easy-to-use non-woven fabric pads.

"SUBA(TM)" is a non-woven pad that demonstrates high performance, stability, and reliability as a polishing pad compatible with various types of substrates, from silicon wafers and glass substrates to GaN and SiC substrates. It achieves an ideal polishing finish with a wide lineup that can accommodate various applications. We respond to various requests, including hard types that emphasize flatness and soft types that focus on planarity. 【Features】 ■ A non-woven pad characterized by a high polishing rate, used for a wide range of polishing targets ■ More than 10 standard types available ■ High hardness and high density pads improve finishing flatness ■ Low hardness and low density pads reduce defects *For more details, please download the PDF or feel free to contact us.

  • Other abrasives

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